High Performance Compact System on Module platform

Background

In line with our strategy of collaborative innovation and our desire to build capabilities that enable accelerated product innovation and design, Agiliad team has designed and implemented a highly sophisticated and robust System on Module platform. This initiative serves multiple purposes for us, it enables us to work closely with customers towards an accelerated concept realization and reduce time to market and also to build capabilities internally that highly differentiate Agiliad in the RnD services market.

Technology

A System on Module (SoM) offers a unique approach to product development and helps system designers realize a fully customized electronics assembly, complete with custom interfaces and form factor without the effort of a ground-up electronics design. There are a number of benefits to the SoM approach vs. ground-up development. These include cost savings, reduced risk, a variety of CPU choices, decreased customer design requirements, a small footprint, and, since software developers can use off the shelf hardware with the same processing core as the finished product, the ability to perform hardware and software development in parallel.

Agiliad Solution

Agiliad SoM board (70 x 50 mm), powered by Xilinx’s high-end Zynq SoC is a highly optimized solution for a variety of embedded applications that demand stringent real time performance, processing power, scalability and ease of configuration.

  • Powered by Xilinx’s high-end Zynq XC7Z020 All-Programmable SoC

  • Production ready, industrial temperature range, compact form factor

  • Combines CPU flexibility with configurability and parallel processing power of FPGA

  • RT Linux and VxWorks OS support in both AMP and SMP configuration

Solution Benefits

  • Combines the flexibility of a CPU with the configurability and parallel processing power of an FPGA

  • Production ready Integrated platform to reduce overall BOM cost and time to market

  • On module power supplies for efficient power management

  • Linux, VxWorks board support package to enable seamless integration

  • Various carrier boards available for instant board bring-up and quick prototyping

  • Technical support by embedded design experts

  

Specifications

  • Dual ARM Cortex-A9 @800MHz
  • On chip Xilinx Artix-7 advanced low power FPGA fabric (1.3M ASIC gates)
  • 1GB DDR-3, 512MB NAND FLASH
  • 1x10/100/1000 BASE-T on module Ethernet interface
  • 1x USB 2.0 OTG on module interface
  • SD card, CAN2.0, I2C, SPI
  • 110 FPGA IO’s
  • Linux, VxWorks BSP support in AMP and SMP configuration
  • Additional 1xUSB 2.0 and 1x10/100/1000 BASE-T Ethernet interface on carrier card
  • 4.5-5.5V input supply
  • 70 mm x 50 mm form factor
  • -20 to 70°C operating temperature